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Semiconductor-specific reflow soldering

1. Reflow the solder paste printed on the bump metal surface into a spherical shape, completing the soldering of the solder ball to the substrate; 2. After the chip is attached to the integrated circuit board, the chip and the circuit board are connected together to achieve chip packaging and integrated circuit manufacturing.

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Characteristics of semiconductor specific reflow soldering products:

1. Patent hot air system, efficient thermal compensation capability, precise temperature control accuracy;

2. Full process nitrogen protection, independent control of nitrogen in each temperature zone to prevent oxidation of components during welding;

3. Low oxygen content control in the furnace, real-time display, the oxygen concentration throughout the process can be controlled within 50-200PPM, ensuring excellent welding quality;

4. Modular design, efficient cooling system, cooling slope can reach 0.5-6 ℃/S, meeting the cooling slope requirements of various processes;

5. The fine mesh belt can smoothly transport small components to prevent dropping and ensure stable product quality;

6. Efficient and clean processing to meet the requirements of semiconductor dust-free workshops.


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