MenuProduct Center

Semiconductor Oven SEO series

The semiconductor oven with nitrogen filled has strong universality, high stability and high performance. It adopts high capacity horizontal air recycling system, adopts special chamber structure and sealing technology, with excellent air tightness and temperature uniformity to meet the high performance requirements of semiconductor products. This oven is suitable for curing semiconductor wafers, IC packages (copper substrate, silver gel, silica gel, epoxy resin), glass substrate and other products.

Get A Quote

  • Product Description
  • FAQ
  • Our Company
  • Global Services
  • Video

Features:

1. High capacity horizontal air recirculation hot air system

2. The chamber is fully sealed design, adopts stainless steel plate, with good air tightness, saving nitrogen

3. The upper and lower box can run independently with different process parameters to meet the production of different products

4. The heating rate is controllable, and the cooling system assists the cooling, which can effectively improve the production efficiency

5. High precision temperature controller, the control accuracy can reach to 0.5℃

6. Test by Class 1000 clean room, it can meet the semiconductor dust-free workshop and product requirements

7. Low oxygen content control, real-time monitoring, the oxygen content can be controlled within 100PPM


未标题-7_01

未标题-7_02

未标题-7_03

未标题-7_04

Related products

在线客服

提交信息,免费获取报价