Equipment principle：
1.Based on operations such as heating, removing, cleaning, repositioning, and soldering BGA chips, to achieve repair and replacement of BGA packaging;
2.Heat the BGA chip through the top temperature zone, bottom temperature zone, and preheating temperature zone to melt the solder joints at the bottom of the chip, and remove the chip from the circuit board;
3.By using the CCD optical alignment system, the solder joints at the bottom of the chip and the solder joints on the circuit board are accurately aligned, and then the soldering is completed through automatic mounting;
Application scope：
1.Suitable for repairing various types of circuit boards such as servers, game console motherboards, PC motherboards, SMT processing, motherboards, other communication motherboards, LCD TV motherboards, security products, tablets, intelligent terminals, etc;
2.Mainly targeting the repair of BGA/POP, PTH, WLESP, QFN, CHIP0201/01005, shielding frames/modules and other components on PCBA substrates;
Feature Highlights：
Other functional features：
1. Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper and lower temperature zones can move synchronously and automatically reach any position within the bottom infrared preheating zone. The lower temperature zone can move up and down, supporting the PCB, and is automatically controlled by a motor. Realize that the PCB remains stationary on the fixture, and the upper and lower heating heads can move together to the
target chip on the PCB;
2. Independent seven axis linkage, with seven motors driving all actions. The upper and lower temperature zones/PCB movement and optical alignment system X/Y movement are both controlled by a joystick, making the operation simple. Equipped with memory function, suitable for batch repair to improve efficiency, high degree of automation;
3. The upper wind head adopts a dual channel hot air heating system and a super large air removal design, which ensures more uniform temperature at all four corners when repairing large-sized components; Fast heating, uniform temperature, fast cooling (can drop suddenly by 50-80 degrees during cooling), better meeting the process requirements of lead-free soldering. The lower heating zone is heated by a mixture of infrared and hot air. Infrared radiation directly acts on the heating area and conducts it simultaneously with hot air, which can compensate for each other's shortcomings and make the PCB heat up quickly (with a heating rate of 10 ℃/s), while still maintaining a uniform temperature;
4. The X/Y direction mobile and unique overall design make full use of equipment space, achieving large area PCB repair with relatively small equipment volume. The maximum clamp size can reach 760x630mm, with no blind spots for repair;
5. The suction nozzle automatically recognizes the suction and mounting height, and the pressure can be controlled within a small range of 10 grams. It has zero pressure suction and mounting functions, suitable for smaller chips;
6. The preheating platform, clamping device, and cooling system can move as a whole in the X direction, making PCB positioning and disassembly soldering safer and more convenient;
7. Unique bottom preheating platform, using excellent heating materials imported from Germany (infrared gold-plated light tube)+anti glare constant temperature glass (temperature resistant to 1800 ℃) with a preheating area of 630x500mm; With the function of preheating the PCB in advance, the preheating trigger temperature can be set. That is, the PCB board is preheated first, and when the PCB board reaches the set trigger value, the head begins to heat the BGA. The advantage of this is that it effectively controls the deformation of the PCB board and shortens the time for the components to be heated by high temperature, effectively improving the success rate of rework;
8.10 stage temperature rise (fall)+10 stage constant temperature control, capable of storing temperature curves in large quantities, and curve analysis can be performed on the touch screen;
9. Equipped with a nitrogen inlet, it can be externally connected for nitrogen protection welding to prevent PCB board from yellowing, making repairs safer and more reliable;
Equipment parameters：
Why choose BGA rework station?
