MenuProduct Center

H.F.X-780 | SMT Line Online Spray Glue Dispensing Machine

Encapsulation protection and reinforcement of PCB and FPC soft board components; Glue dispensing for camera module and fingerprint recognition module; IC chips, bottom filling of components, and component encapsulation; Glue on the outer shell frame; Fluorescent powder filling for light-emitting diodes; Red glue, dam enclosure, precision coating, etc.

Get A Quote

  • Product Description
  • FAQ
  • Our Company
  • Global Services
  • Video

Product features:

1. Encapsulation protection and reinforcement of PCB and FPC soft board components.

2. Glue dispensing for camera module and fingerprint recognition module.

3. Bottom filling and encapsulation of IC chips and components.

4. Glue on the outer shell frame.

5. Fluorescent powder filling for light-emitting diodes.

6. Red glue, dam enclosure, precision coating, etc.


点胶D3_01

点胶D3_02

点胶D3_03

点胶D3_05

点胶D3_06

点胶D3_07

点胶D3_08

点胶D3_09

点胶D3_10

点胶D3_11

在线客服

提交信息,免费获取报价