Equipment principle：
1.Non destructive testing of the internal structure of the object being tested by utilizing the penetrability of X-rays and the absorption and scattering characteristics of substances towards X-rays.
2.The X-rays attenuated by the object reach the high-resolution image flat panel detector and undergo digital conversion to form a high-definition two-dimensional grayscale image.
3.The data processing system processes and analyzes images to accurately determine whether there are defects, foreign objects, structural abnormalities, and other adverse issues inside the object.
Application scope：
1.Mainly used in fields such as automotive electronics, energy electronics, home appliance electronics, consumer electronics, semiconductors, die-casting, etc.
2.Suitable for testing SMT mounting, BGA solder joints, packaged devices, semiconductor components, precision metal castings, injection molded products, etc.
3.Suitable for PCBA, chips LED、IGBT、 Wires, sensors, fuses, QFNs, MOSFETs FPC、 Non destructive testing of new energy lithium batteries, power cords, diodes, capacitors, automotive parts, aviation parts, etc.
Test case：
Functional Features：
Other features：
1. The device software is easy to operate, with quick mouse clicks to reach any observation position on the loading platform. It can be trained in two hours to get started.
2. Small footprint, convenient for placement and use, high-resolution design for optimal image quality.
3. Tilt and rotate multi angle detection, facilitating multi angle analysis of internal structural defects of objects.
4. CNC automated detection, automatically identifying good and defective products, with higher detection efficiency.
5. Multiple mechanisms such as safety interlock and automatic shutdown of radiation sources when the equipment is idle.
Technical Parameter：
Detection effect：
