Equipment principle：
1.Based on operations such as heating, removing, cleaning, repositioning, and soldering BGA chips, to achieve repair and replacement of BGA packaging.
2.Heat the BGA chip through the top temperature zone, bottom temperature zone, and preheating temperature zone to melt the solder joints at the bottom of the chip, and remove the chip from the circuit board.
3.By using the CCD optical alignment system, the solder joints at the bottom of the chip and the solder joints on the circuit board are accurately aligned, and then the soldering is completed through automatic mounting.
Application scope：
1.Suitable for repairing various types of circuit boards such as servers, game console motherboards, PC motherboards, SMT processing, motherboards, other communication motherboards, LCD TV motherboards, security products, tablets, intelligent terminals, etc;
2.Mainly targeting the repair of BGA/POP, PTH, WLESP, QFN, CHIP0201/01005, shielding frames/modules and other components on PCBA substrates;
Feature Highlights：
Other functional features：
1.It has 5 working modes, namely: disassembly, welding, mounting, semi-automatic, and manual.
2.X. The Y-axis and R angles are fine tuned with a micrometer, ensuring precise alignment with an accuracy of ± 0.01mm;
3.The independent three temperature zone temperature control system has a temperature accuracy controlled within ± 1 ℃, and can simultaneously set up 8 temperature controls to ensure uniform heating of the PCB board, prevent deformation, and ensure welding effectiveness. The heating plate can independently control heating;
4.Adopting high-precision K-type thermocouple closed-loop control and PID parameter tuning system, it can simultaneously display four sets of temperature curves and store multiple sets of user data, and has instant curve analysis function to improve the repair yield;
