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Infrared curing oven IR-3C

The SMT PCB infrared curing oven is primarily used for glue curing applications and for drying anti-corrosion paint. H.F.X brings 12 years of experience in the SMT industry. Highlights: On-site installation and training Available, 24/7 Customer Service. Highly Trained Experts.Accurate and economical. Vision guided DIY kit. Easy To Assemble. Open Source Software. We can customize equipment according to your production needs.

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Application of PCB IR Curing Oven & IR oven :

1


Features

1. Conveying system: It adopts a chain conveying method. The width between the chains can be adjusted within the range of 50-450mm to meet various connection methods of customers. The chains use stainless steel extended pin chains, and the conveying speed is adjustable. The specially made reinforced aluminum alloy guide rails can resist high temperatures. Combined with the support adjustment mechanism, they ensure minimal deformation, prevent the rails from shaking, and eliminate the phenomenon of board falling.

2. Heating system: It adopts the heating principle of heating tubes, and uniform heating improves heating efficiency. Both the furnace and the inner container are welded with T1.5 iron plates, which are sturdy and durable. Thickened insulation cotton is stuffed on the periphery to ensure minimal heat loss, save electricity, prevent the ambient temperature from rising, and avoid increasing the load on the air conditioner.

3. Heating control system: PID temperature controller + touch screen control, realizing precise temperature control of 2 temperature zones, minimizing energy consumption, with a maximum controlled temperature of 150℃.

4. Whole line docking: The equipment is equipped with the SMT industry standard SMEMA interface, which can perform signal docking with other equipment.

IR-system-and-Transport-system

                   IR system                                                                                                                                                                 Transport system


Technical Specifications

   Overall dimensions   L*W*H   L2000mm*W1080mm*H1300mm
   PCB transmission height   910±20mm
   Transport speed   0-3500mm/min
   Transmission direction   L→R□   R→L□
   Transmission motor   Stepper motor + reducer
   Conveying method   Chain conveying (35B5mm extended pin stainless steel chain)
   PCB width   MAX450mm
   Number of temperature zones   A total of 2 temperature zones
   Temperature adjustment range   Room temperature — 150 degrees
   Heating time   <10 minutes
   Size of PCB board   MAX:W450*L450
   Height of components passing through the   PCB board   MAX:±110mm
   Opening method   Software interface control, electric lifting
   Control method   PLC + touch screen control
   Equipment weight   Approx.530KG
   Device power supply   AC380V, 50Hz (customizable)
   Total power of the equipment   6.5KW

> Equipment can be customized according to customer needs

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