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BGA ball placement heating station ZQ-350

The ZQ-350 ball placement station features a reflow oven function, meeting the conditions for solder paste preheating, activation, heating, and cooling

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Features:

1. Equipped with a reflow oven function, meeting the conditions for solder paste preheating, activation, heating, and cooling;

2.  Digital display instruments are used for temperature control, and K-type thermocouples are employed for temperature measurement, ensuring precise temperature control with minimal fluctuations;

3.  Under the same conditions, it can simultaneously solder BGA chips of different specifications, and it features an alarm function after soldering is completed;

4.  Equipped with high-temperature cloth to prevent damage to BGA chips.


Technical Specifications:

1. Heating area: 120mm×200mm;

2. Power: 600W;

3. Temperature setting: adjustable from room temperature to 300℃, with PID temperature control;

4. Timed alarm time: 0.01S~99.99H;

5. Operating voltage: AC110~220V (customization supported);

6. Overall dimensions: 310mm×280mm×145mm (L×W×H);

7. Weight: approximately 7.5kg.


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