Product description：
1. Optical alignment, utilizing servo motors to precisely move and adjust the position, ensuring more accurate alignment between the chip and the screen printing plate during mounting;
2. Equipped with automatic solder paste scraping and automatic ball placement functions, with all X, Y, Z axes controlled by servo motion control, and equipped with a touch screen and high-definition display, it is fully functional and completely hands-free;
3. The chip mold is made of high-temperature resistant materials to ensure more uniform heating of the chip, and elastic devices are added on the outside of the product for positioning, making the positioning more accurate;
4. Embedded industrial computer, high-definition touch screen human-machine interface, user-friendly operation interface, pre-built programs, easy to operate and master;
5. The top of the ball planting machine is equipped with a protective cover and a door, and the top of the protective cover is fitted with a smoke exhaust vent, ensuring a clean and pollution-free indoor air environment during operation;
Technical Specifications：
Serial number | Project | Parameter |
| 1 | Planting ability (MM) | 0.2-1.5mm |
| 2 | Applicable BGA chip size (mm) | 2*2-300*300mm |
| 3 | Plant ball yield (%) | ≥98 |
| 4 | Planting ball accuracy (mm) | ±0.02mm |
| 5 | Solder ball static elimination device | The standard configuration includes a solder ball static elimination function to prevent solder balls from clumping together due to static electricity |
| 6 | Solder ball medium | Support scraping of solder paste or flux paste |
| 7 | Solder ball collection device | Equipped with quick solder ball recovery function |
| 8 | Replacement of ball planting mold | Support quick mold change, with a single operation time not exceeding 5 minutes |
| 9 | X, Y, Z adjustment accuracy | ±0.02mm |
| 10 | Heating mode | Non-contact thermal radiation to avoid damage |
| 11 | Temperature measurement channel | 1 piece |
| 12 | Temperature control accuracy (℃) | ±3℃ |
| 13 | Nitrogen welding | Reserve a nitrogen device and choose to use it |
| 14 | CCD vision system pixel | 20 million |
| 15 | Optical zoom | 72 times |
| 16 | Digital zoom | 36 times |
| 17 | Resolution | 1920*1080P |
| 18 | Zoom mode | Automatic |
| 19 | Power supply | AC 110-220V 50/60Hz（Customization supported） |
| 20 | Gas source | 0.2-0.6Mpa 30-50L/min |
| 21 | Electrostatic grounding device | The equipment is equipped with an electrostatic grounding device as standard |
| 22 | Coplanarity of solder balls | Deviation less than 1% |
