Application area:
Selective wave soldering is a special form of wave soldering invented to meet the development requirements of through-hole component soldering.
Mainly suitable for soldering through-hole components in high-end electronic products. For example, industries such as military electronics,
automotive electronics, and switch power supply products that require high welding reliability.
Selective soldering MWS-6800 Feature:
Independent R&D electromagnetic pump
Chain and roller hybrid drive system
Automatic rail width adjustment system
High precision spray nozzle
Bottom side infrared preheating
Top side hot air convection heating
Support online/offline programming, easy programming
Welding parameters can be set independently for each solder joint
Display welding status throughout the whole process
Extensible to dual electromagnetic pumps selective soldering
Basic machine module：
| Flux Module | Preheat Module | Soldering Module | Conveyor System |
Soldering process：
Transport the PCB to flux module
Spray head move to programed area and flux is applied only to the soldering joint to be made
Top -side and bottom-side preheat
Programed electromagnetic pump soldering perfectly formed solder joint
PCB is transported out
Working Process:After PCB is moved to flux area,the spray head istargeted to the programed position and thefluxis applied only tothe solder jointto bemade.After preheating,the electromagnetic pumpmoves to the target areaand solder joint is made.
Product parameters:
| Specifications | ||
| Model NO. | MWS-6800 | MWS-6800A |
| General Parameters | ||
Overall dimension(mm)(Not include indicator light and monitor) | 2710(L)*1930(W)*1630(H) | 3040(L)*2240(W)*1630(H) |
| Equipment Weight(kg) | 1550 | 2000 |
| Max PCB size(mm) | 510(L)*450(W) | 610(L)*610(W) |
| Min PCBsize(mm) | 120(L)*50(W) | 120(L)*50(W) |
| PCB Top Side Clearance(mm) | 120 | 120 |
| PCB Bottom SideClearance(mm) | 60 | 60 |
| PCB process edge(mm) | ≥3 | ≥3 |
| Conveyor Height From Floor(mm) | 900±20 | 900±20 |
| PCB Conveying Speed(m/min) | 0.2-10 | 0.2-10 |
| Max PCB Weight (kg) | ≤8 | ≤8 |
| PCB Thickness With Jig(mm) | 1-6 | 1-6 |
| Conveyor Width Adjustment Range(mm) | 50-450 | 50-610 |
| Conveyor Width Adjustment Mode | Electric | Electric |
| PCB Conveying Direction | Left to right | Leftto right |
| Air Input Pressure(Mpa) | 0.6 | 0.6 |
| Nitrogen Supply | Offered by customer | Offered by customer |
| Nitrogen Input Pressure(Mpa) | 0.6 | 0.6 |
| Nitrogen Consumption(m³/h) | 1.5 | 1.5 |
| Required Purity of Nitrogen(%) | >99.999 | >99.999 |
| Supply Voltage(VAC) | 380 | 380 |
| Frequency(HZ) | 50/60 | 50/60 |
| Max Power Consumption(kw) | <30 | <36 |
| Max Current(A) | <56 | <61 |
| Ambient Temperature(℃) | 10-35 | 10-35 |
| Machine Noise Level(dB) | <65 | <65 |
| Communication Interface | SMEMA | SMEMA |
| Soldering System | ||
| Max.Solderingdistance of Xaxis(mm) | 510 | 610 |
| Max.Soldering distanceof Yaxis(mm) | 450 | 610 |
| Max.Soldering distance of Zaxis (mm) | 60 | 60 |
| Nozzle outer diameter (mm) | 5、6、8、9、10、12、14 | 5、6、8、9、10、12、14 |
| Nozzle inner diameter(mm) | 2.4.3、4、5、6、8、10 | 2.4、3、4、5.6.8、10 |
| Max soldering wave height(mm) | 5 | 5 |
| Solder potcapacity (kg) | Approx.13kg(Sn63Pb)/solder pot | Approx.13kg(Sn63Pb)/solder pot |
| Approx.12kg(lead-free)/solder pot | Approx.12kg(lead-free)/solder pot | |
| Max soldering temperature(℃) | 330 | 330 |
| Soldering heating power (kw) | 1.15 | 1.15 |
| Preheating System | ||
| Preheat temperature range(℃) | <200 | <200 |
| Heating power (kw) | 17 | 21.5 |
| Heating mode | Hot air+Infrared | Hot air+Infrared |
| Top side preheating | Hot air | Hot air |
| Spraying System | ||
| Max.stroke of X axis(mm) | 510 | 610 |
| Max.stroke ofY axis (mm) | 450 | 610 |
| Spray height(mm) | 60 | 60 |
| Location speed(mm/s) | <400 | <400 |
| Spray head automatically cleaning | Program contro | Program control |
| Flux box capacity(L) | 2 | 2 |
| Remarks:Other models of MWS single pump series can be customized. | ||
